Leading High Density Interconnect PCB Manufacturing
Leading High Density Interconnect PCB Manufacturing provides advanced HDI solutions with laser microvias, fine traces, and multilayer structures for high-density and high-performance electronic products.
Advantages
HDI PCB Manufacturing Advantage
HDI PCB Manufacturing Advantage enables finer traces, laser microvias, and higher wiring density, providing enhanced electrical performance and space-saving solutions for advanced electronic applications.
In-house Integration
In-house Integration enables complete control over HDI PCB production, from laser drilling and imaging to plating and testing, ensuring consistent quality, shorter lead times, and improved manufacturing efficiency.
End-to-end process control
Faster production turnaround
Stable quality consistency
Reduced outsourcing risks
Enhanced manufacturing efficiency
Advanced Equipment
Advanced Equipment supports high-precision HDI PCB manufacturing with laser drilling, direct imaging, and automated inspection systems, ensuring excellent registration accuracy, stable process control, and reliable performance for complex multilayer designs.
Laser microvia drilling systems
Direct imaging technology
Automated process control
High-precision layer alignment
Advanced inspection equipment
High-Mix, Low-Volume
High-Mix, Low-Volume manufacturing provides flexible HDI PCB production for prototypes and diverse product requirements, enabling rapid changeovers, stable quality, and efficient support for complex and customized electronic applications.
Flexible production scheduling
Fast prototype support
Multiple product configurations
Efficient changeover capability
Consistent quality performance
Production Excellence
Advanced HDI PCB Production Excellence
Advanced HDI PCB Production Excellence delivers superior interconnection density, precise microvia structures, and stable manufacturing quality for high-performance electronic applications.
Laser Drilling
Laser drilling enables accurate microvia formation for HDI PCB, supporting fine-pitch and compact designs.
01
Sequential Lamination
Sequential lamination supports multilayer HDI designs with accurate layer buildup and stable performance.
02
Through-hole Plating
Through-hole plating provides stable copper coverage for dependable conductivity and interconnection.
03
Fine Etching
Fine etching enables precise circuit definition for HDI boards with fine lines and high density.
04
Manufacturing Capability
HDI PCB Manufacturing Capability
The Production Capacity Table presents essential HDI PCB specifications, covering layer structures, fine-line capability, laser microvias, and process tolerances for advanced electronic applications.
Item
Capability
Layer Count
4–64 Layers
Board Thickness
0.2–3.2 mm
Copper Thickness
0.5–10oz
Surface Finish
ENIG, OSP, Immersion Silver
Impedance Control Tolerance
>±5%
Registration Accuracy
±25 μm
IPC Standard
IPC Class 2 / Class 3
Item
Capability
HDI Type
1+N+1, 2+N+2, 3+N+3
Sequential Lamination
Up to 6 Times
Laser Via Diameter
0.075 mm
Laser Pad Size
0.175 mm
Via Capture Pad
0.225 mm
Min Trace Width/Space
2/2 mil
Via-in-Pad
Filled & Capped
Stacked Microvias
Available，》6 Times
Staggered Microvias
Available
Copper Filling Process
Available，0.15 mm < Hole Diameter ≤ 3.0 mm
Resin Plugging
Available，0.2 mm < Hole Diameter ≤ 0.6 mm
Any-Layer HDI
Available
AOI Inspection
100%
X-ray Alignment
Available
The table above only lists process parameters for HDI PCB products. Please download the full process manual.
Quality Control
Quality Control of HDI PCB
Quality Control of HDI PCB applies strict process monitoring, AOI, and electrical testing to ensure precision, reliability, and consistent manufacturing quality.
Quality Control Equipment
Quality Control Equipment integrates AOI systems, X-ray inspection, and flying probe testing to ensure precise defect detection and consistent HDI PCB manufacturing quality.
AOI Inspection Systems
AOI inspection systems enable real-time defect detection on HDI PCB, ensuring accurate solder joints, trace integrity, and consistent quality throughout high-density production processes.
X-Ray Inspection Equipment
X-ray inspection equipment verifies hidden solder joints and microvia structures, ensuring internal connection reliability and detecting defects in complex HDI PCB assemblies.
Flying Probe Testing
Flying probe testing provides flexible electrical verification for HDI PCB, ensuring circuit continuity, insulation performance, and stable functionality without custom fixtures.
Automated Electrical Testing
Automated electrical testing systems validate HDI PCB performance, detecting opens, shorts, and resistance issues to ensure reliable operation in advanced electronic applications.
Quality Control Equipment
The Production Capacity Table presents essential HDI PCB specifications, covering layer structures, fine-line capability, laser microvias, and process tolerances for advanced electronic applications.
IS0 9001:2015
stepping stone
The most fundamental and universally applicable quality management systemcertification.
IPC A 610
Industry Standard
The most authoritative international standard for the acceptance of electronic assembly and PCB manufacturing.
IATF 16949:2016
Automotive-grade (high gold content)
Demonstrate the capability to manufacture highly reliable automotive PCB.
ISO 13485
Medical-grade (high gold content)
Demonstrate the capability to manufacture high-precision PCB for medical equipment.
ISO14001:2015
Environmental system
Green factory certification is highly valued by major manufacturers and overseas clients.
UL
Safety Certification
Mandatory safety and flame-retardant standards for entering the North American market.
RoHS
Environmental regulations
Restriction of Hazardous Substances (RoHS) Directive (a standard requirement for electronic products exported to the EU).
REACH
Environmental regulations
EU Regulation on the Registration, Evaluation, Authorisation and Restriction of Chemicals.
IS0 9001:2015
01
IPC A 610
02
IATF 16949:2016
03
ISO 13485
04
ISO14001:2015
05
UL
06
RoHS
07
REACH
08
Applications
HDI PCB Application
HDI PCB Application supports compact and high-performance electronic products, widely used in mobile devices, automotive electronics, industrial systems, and advanced communication equipment.
01
Smart Devices
02
Automotive Electronics
03
Communication Equipment
04
Medical Electronics
05
Industrial Control
01
Smart Devices
HDI PCB are widely used in smartphones, wearables, and smart home devices, enabling compact designs, high-speed signal transmission, and reliable performance for modern consumer electronics.
02
Automotive Electronics
HDI PCB applications in automotive systems support ADAS, infotainment, and control units, delivering stable performance, high reliability, and resistance to harsh environmental conditions.
03
Communication Equipment
HDI PCB are essential for communication devices such as base stations and network modules, ensuring high-frequency performance, signal integrity, and dense interconnection capability.
04
Medical Electronics
HDI PCB support advanced medical devices, offering high precision, reliability, and miniaturization for diagnostic, monitoring, and life-support electronic systems.
05
Industrial Control
HDI PCB applications in industrial control systems provide stable operation, high durability, and precise signal processing for automation, robotics, and intelligent manufacturing equipment.
FAQ
HDI PCB FAQ
HDI PCB FAQ explains common questions about stack-up design, microvia technology, materials, tolerances, and testing standards to support efficient engineering communication.
Q1
What is the typical layer count for HDI PCB production?
HDI PCB typically range from 4 to 12 layers, depending on design complexity and application requirements, with support for sequential lamination structures.
Q2
What microvia technologies are used in HDI PCB?
Laser-drilled microvias, blind vias, and buried vias are commonly used to achieve high-density interconnection and improved signal performance.
Q3
What materials are suitable for HDI PCB manufacturing?
Standard FR4, high-Tg materials, and low-loss laminates are used based on electrical performance, thermal requirements, and application environments.
Q4
What quality testing is applied to HDI PCB?
HDI PCB undergo AOI inspection, X-ray analysis, electrical testing, and reliability validation to ensure consistent quality and defect-free production.
Solutions
HDI PCB Solutions
HDI PCB Solutions provide high-density routing, laser microvia technology, and multilayer integration for demanding applications in automotive, communication, medical, and consumer electronics.
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