Leading Flex Assembly End to End Services
Leading Flex Assembly End to End Services provide high-precision flexible circuit assembly, controlled soldering, and full inspection processes, ensuring reliable interconnection, stable signal performance, and durable PCB flexibility for advanced applications.
Advantages
Flex AssemblyCore Advantage
Flex Assembly Core Advantage delivers high flexibility, precise circuit alignment, and stable electrical performance, enabling reliable interconnection and durability for complex flexible PCB applications in compact electronic designs.
Total In-house Integration
Total In-house Integration in Flex Assembly ensures complete control over flexible PCB production, from material handling to assembly and inspection, improving process stability, quality consistency, and interconnection reliability.
Full process internal control
Reduced outsourcing risks
Stable flexible PCB quality
Faster production turnaround
Improved yield consistency
Advanced and Sufficient Inspection Equipment
Advanced and Sufficient Inspection Equipment in Flex Assembly ensures accurate detection of defects in flexible circuits, including alignment, solder quality, and continuity, delivering stable performance and high-reliability PCB assembly results.
High-resolution AOI systems
Flexible circuit X-ray inspection
Real-time defect monitoring
Precision continuity testing
Stable quality verification
Supply Chain and Spare Parts
Supply Chain and Spare Parts in Flex Assembly ensure stable sourcing of flexible materials and reliable component availability, reducing production risk and supporting continuous delivery for complex flexible PCB manufacturing.
Stable global material sourcing
Flexible component supply network
Fast spare parts replacement
Risk-controlled procurement flow
Continuous production support
Capabilities
Flex Assembly Capabilities
Flex Assembly Capabilities include precision flexible circuit assembly, fine-pitch component placement, controlled soldering processes, and strict inspection systems, ensuring reliable electrical performance and durable PCB flexibility.
Manufacturing Process
Key Factors in Flex Assembly
Reliable flex assembly requires precise component placement, controlled bending design, optimized soldering processes, and careful handling to ensure stable electrical performance and long-term mechanical reliability.
Material Flexibility Control
Key Factors in Flex Assembly include strict material flexibility control to ensure stable bending performance, preventing cracks and deformation while maintaining reliable electrical conductivity in dynamic flexible PCB applications.
01
Thermal Management Design
Key Factors in Flex Assembly rely on precision alignment control during component placement to ensure accurate positioning, stable solder joints, and consistent electrical performance across high-density flexible circuit structures.
02
Thermal Process Stability
Key Factors in Flex Assembly emphasize thermal process stability during soldering and reflow, ensuring uniform heat distribution, preventing delamination, and maintaining reliable interconnection in flexible PCB assemblies.
03
Mechanical Stress Management
Key Factors in Flex Assembly require effective mechanical stress management to reduce strain during bending and operation, ensuring long-term durability and stable signal transmission in flexible electronic systems.
04
Manufacturing Capability
Production Capacity Table
Production Capacity Table for Flex Assembly provides clear visibility of flexible PCB assembly capability, throughput, inspection coverage, and delivery capacity, enabling efficient planning and stable execution for complex flexible electronics manufacturing.
Item
Capability
Assembly Type
SMT, THT, Mixed Technology
PCB Size
Min. 50 × 100 mm，Max. 510 × 480 mm
Board Type
Rigid, Flex, Rigid-Flex, Aluminum PCB, Ceramic PCB
Assembly Standard
IPC-A-610 Class 2 / Class 3
Lead-Free Process
Available
RoHS & REACH Compliance
Yes
ESD Protection
ANSI/ESD S20.20
Minimum Chip Size
01005 (0.4 × 0.2 mm)
Fine Pitch IC
0.30 mm
Minimum BGA Pitch
0.30 mm
Maximum BGA Size
80 × 80 mm
BGA Ball Count
Up to 3000 Balls
Maximum Component Height
40 mm
Maximum Component Weight
100 g
The table above only lists process parameters for HDI PCB products. Please download the full process manual.
Quality Control
Flex Assembly Quality Control
Flex Assembly Quality Control ensures strict monitoring of flexible PCB processes, including placement, soldering, and continuity testing, delivering stable interconnects and consistent high-reliability performance in dynamic electronic applications.
Core Quality Control Methods
Core Quality Control Methods in Flex Assembly include SPI monitoring, AOI inspection, continuity testing, and visual verification, ensuring accurate flexible circuit assembly, stable solder joints, and reliable electrical performance.
SPI Solder Monitoring
Core Quality Control Methods in Flex Assembly begin with SPI solder monitoring to control paste volume and printing accuracy, ensuring stable solder foundation and reliable flexible PCB assembly performance across all production stages.
AOI Inspection Control
Core Quality Control Methods in Flex Assembly include AOI inspection control to detect placement errors, polarity issues, and visible defects, ensuring consistent assembly accuracy and reducing rework in flexible circuit manufacturing.
Continuity Testing Process
Core Quality Control Methods in Flex Assembly rely on continuity testing process to verify electrical connectivity and signal stability, ensuring each flexible PCB meets strict functional and reliability requirements before final delivery.
Visual Quality Verification
Core Quality Control Methods in Flex Assembly finalize with visual quality verification to confirm component alignment, solder quality, and surface condition, ensuring consistent high-quality output in flexible electronic assemblies.
Certifications
Certifications in Flex Assembly demonstrate compliance with ISO quality management systems, IPC-A-610 workmanship standards, and RoHS environmental directives, ensuring controlled flexible PCB manufacturing processes, full traceability, and consistent high-reliability assembly quality for global applications.
IS0 9001:2015
stepping stone
The most fundamental and universally applicable quality management systemcertification.
IPC A 610
Industry Standard
The most authoritative international standard for the acceptance of electronic assembly and PCB manufacturing.
IATF 16949:2016
Automotive-grade (high gold content)
Demonstrate the capability to manufacture highly reliable automotive PCB.
ISO 13485
Medical-grade (high gold content)
Demonstrate the capability to manufacture high-precision PCB for medical equipment.
ISO14001:2015
Environmental system
Green factory certification is highly valued by major manufacturers and overseas clients.
UL
Safety Certification
Mandatory safety and flame-retardant standards for entering the North American market.
RoHS
Environmental regulations
Restriction of Hazardous Substances (RoHS) Directive (a standard requirement for electronic products exported to the EU).
REACH
Environmental regulations
EU Regulation on the Registration, Evaluation, Authorisation and Restriction of Chemicals.
IS0 9001:2015
01
IPC A 610
02
IATF 16949:2016
03
ISO 13485
04
ISO14001:2015
05
UL
06
RoHS
07
REACH
08
Applications
Flex Assembly Application
Flex Assembly Application spans consumer electronics, automotive systems, medical devices, industrial control, and communication equipment, delivering compact flexible interconnects, stable signal performance, and reliable operation in dynamic environments.
01
Consumer Electronics
02
Automotive Systems
03
Communication Equipment
04
Medical Devices
05
Industrial Control
01
Consumer Electronics
Flex Assembly Application in consumer electronics enables compact and lightweight flexible circuits for smartphones, wearables, and tablets, ensuring stable signal transmission, space-saving design, and reliable performance in high-density devices.
02
Automotive Systems
Flex Assembly Application in automotive systems supports integration of sensors, displays, and control modules, providing vibration resistance, thermal stability, and long-term durability in complex vehicle electronic environments.
03
Consumer Electronics
Flex Assembly Application in communication equipment supports high-speed signal transmission in compact designs, ensuring low-loss interconnections, stable performance, and reliable operation in networking and telecom systems.
04
Medical Devices
Flex Assembly Application in medical devices ensures high-precision flexible interconnects for diagnostic and monitoring equipment, delivering stable electrical performance, patient safety, and reliable operation in critical healthcare applications.
05
Industrial Control
Flex Assembly Application in industrial control enables robust flexible PCB integration for automation systems and control units, ensuring stable signal integrity, high durability, and continuous operation in harsh industrial environments.
FAQ
Flex Assembly FAQ
Flex Assembly FAQ covers material selection, lead time, design constraints, inspection standards, and production capability, helping customers understand flexible PCB manufacturing flow, quality control methods, and feasibility for different applications.
Q1
What is the typical lead time for Flex Assembly?
Lead time depends on design complexity, material type, and order volume, with prototypes typically completed in a few days and production scheduled efficiently for stable delivery.
Q2
What materials are used in Flex Assembly?
Flex Assembly commonly uses polyimide and other flexible substrates designed to withstand repeated bending while maintaining stable electrical performance and long-term reliability.
Q3
How is quality ensured in Flex Assembly?
Quality is ensured through SPI, AOI, continuity testing, and visual inspection, covering all critical stages from placement to final electrical verification.
Q4
Can Flex Assembly support high-density designs?
Yes, Flex Assembly supports fine-pitch and high-density designs, enabling compact layouts with reliable interconnections for advanced electronic applications.
Solutions
Flex Assembly Solutions
Flex Assembly Solutions provide end-to-end services from design support to assembly, inspection, and testing, ensuring precise flexible interconnections, stable signal performance, and reliable manufacturing for advanced electronic systems.
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